QFN Moulding Tape #1025010-21C
1.Features
High Heat Resistance use by PI base film
TO prevent attachment of particles in a heat process
Minimum Contamination of Leadframe by adhesive Residue
2.Structure
| Adhesive | Base Maleriul | Color | Width |
| silica gel | Polyimide | Amber | Max 500mm |
3.Applications
For fixing lead frme of IC package.
4.Properties
| Test Items | Standard value | Test value | Test Mathod |
| Base Malerial Thickness (um) | 25±2 | 25 | ASTM D3652 |
| Glue Thickness (um) | 10±2 | 10 | ASTM D3652 |
| Substnte Thicknss (um) | 50±3 | 50 | ASTM D3652 |
| Aggregale Thickness (um ) | 35±4 | 35 | ASTM D3652 |
| Adhesion( g/25mm) | 50-100 | 67 |
ASTM D3330 SUS304 |
| Heal Resistancd （Our melal） | 240°C*30min | ||
| Tempemture Endumncd Coppar foil) | 220°C*1H | ||
5.Storage Condition
The storage period is hal fa year after shipment. Avoid direct sunlight and store at temperatures of 23+5°C and humidity under 55+10%.
QFN封装流程
