Model Number：A15010-12C、A15010-32、A15020-12C
Application: Post-mold singulation for QFN, DFN, and BGA packages.
Processed Material: Epoxy Resin (Min. Die Size: 0.6 x 0.3 mm)
| Model | Substrate | Total thickness | 180°Adhesion（uv After） |
| A15010-32 | PO(150μm) | 160 | 9.78 (0.04) |
| A15010-12C | PO(150μm) | 160 | 15.6 (0.04) |
| A15020-12C | PO(150μm) | 160 | 20.3 (0.05) |
Model Number：A15020-12C、A15010-12C
Application: MEMS Package Singulation
Processed Material: Epoxy Resin
| Model | Substrate | Total thickness | 180°Adhesion（uv After） |
| A15010-12c | PO(150μm) | 170 | 15.6 (0.04) |
| A15020-12C | PO(150μm) | 170 | 20.3 (0.05) |
Model Number:C10015-13B
Process Applied:Wafer Protection
Material:WAFER
| Model | Substrate | Total thickness | 180°Adhesion（uv After） |
| C10015-13B | PET(100μm) | 115 | 10.23 (0.1) |
Model Number:A15020-12C A15010-32
Process Applied:SMD,CSP Post-Packaging Singulation
Material:EMC Substrate,Silicone-based Materials
| Model | Substrate | Total thickness | 180°Adhesion（uv After） |
| A15010-32 | PO(150μm) | 160 | 9.78 (0.04) |
| A15020-12C | PO(150μm) | 170 | 18.7 (0.05) |
Model Number:VO8010B-26 B09010-22D B08005-22
Process Applied:Wafer Dicing
Material:WAFER
| Model | Substrate | Total thickness | 180°Adhesion（uv After） |
| V08010B-26 | PVC(80μm) | 90 | 2.31 (0.08) |
| B09010-22D | PO(90μm) | 100 | 4.93 (0.04) |
| B08005-22 | PO(80μm) | 85 | 7.73 (0.06) |
Model Number:B09010-2E2D
Process Applied:Wafer Dicing
Material:WAFER
| Model | Substrate | Total thickness | 180°Adhesion（uv After） | Anti-static |
| B09010-2E2D | PO(90μm) | 100 | 7.22 (0.1) | Surface Resistivity: Anti-static 10^9Ω |
Model Number:102510-21C
Process Applied:MOLDING
Material:Frame
| Model | Substrate | Total thickness | 180°Peeling force | Heat Resistance |
| 102510-21C | PI(25μm) | 35 | 0.69N/25mm | 220C*1H |
