Specifications for Substrate Products
|
Model
|
Backing Film
|
Thickness
|
Glue Thickness
|
180°Adhesion (after UV irradiation)
|
90°Adhesion (after UV irradiation)
|
Recommended Workpiece
|
Remarks
|
|
A15010-32
|
PO(150μm)
|
160
|
10
|
9.78 (0.15)
|
2.42 (0.03)
|
Substrate PCB / Glass
|
General Purpose / High Adhesion
|
|
A15010-12C
|
PO(150μm)
|
160
|
10
|
16.6 (0.1)
|
2.63 (0.04)
|
High Adhesion
|
|
|
A15010-42L
|
PO(150μm)
|
160
|
10
|
9.56 (0.1)
|
2.36 (0.03)
|
Substrate PCB / Glass
|
|
|
A15020-11
|
PO(150μm)
|
170
|
20
|
14.9 (0.26)
|
4.33 (0.06)
|
Substrate PCB / Glass
|
Anti-Flying Chip
|
|
A15020-12C
|
PO(150μm)
|
170
|
20
|
21.8 (0.11)
|
3.38 (0.04)
|
Substrate PCB / Glass
|
|
Wafer-Level Process Materials
|
Model
|
Backing Film
|
Thickness
|
Glue Thickness
|
180°Adhesion (after UV irradiation)
|
90°Adhesion (after UV irradiation)
|
Recommended Workpiece
|
Remarks
|
|
B09010-11
|
PO(90μm)
|
100
|
10
|
8.3(0.26)
|
2.21 (0.04)
|
Wafer
|
Reduced Backside Chipping
|
|
B09010-22D
|
PO(90μm)
|
100
|
10
|
3.9(0.08)
|
1.96 (0.04)
|
Wafer / MEMS / Glass
|
Easy Peeling
|
|
B08005-22
|
PO(80μm)
|
85
|
5
|
6.2(0.11)
|
1.72 (0.03)
|
Wafer
|
Easy Peeling
|
|
V08010B-26
|
PVC(80μm)
|
90
|
10
|
2.31(0.28)
|
1.57 (0.14)
|
Wafer / Silicon Wafer / Grinding
|
Film Expansion
|
|
V08010-36
|
PVC(80μm)
|
90
|
10
|
2.45(0.31)
|
1.62 (0.15)
|
Wafer
|
Film Expansion
|
|
N08010B-31A
|
PVC(80μm)
|
90
|
10
|
0.81
|
|
Film Inversion
|
Non-UV Blue Tape
|
Details for Ceramic & Glass Products
|
Model
|
Backing Film
|
Thickness
|
Glue Thickness
|
180°Adhesion (after UV irradiation)
|
90°Adhesion (after UV irradiation)
|
Recommended Workpiece
|
Remarks
|
|
C10020-22C
|
PET(100μm)
|
120
|
20
|
14.8
|
2.61 (0.03)
|
Ceramic / Glass / Crystal
|
Non-Expanding
|
|
C0502020-481
|
PET(50μm)
|
90
|
各20
|
各>12(≤0.1)
|
—-
|
Glass
|
Double-Sided UV Adhesive
|
Details for High-Temperature Resistant Products
|
Model
|
Backing Film
|
Thickness
|
Glue Thickness
|
180°Adhesion (after UV irradiation)
|
90°Adhesion (after UV irradiation)
|
Recommended Workpiece
|
Remarks
|
|
C10015-13B
|
PET(100μm)
|
115
|
15
|
11.31 (0.08)
|
4.31 (0.08)
|
Suitable for Wafer Protection / Photolithography Process
|
150℃*30min
|
|
I02510-21C
|
PI(25μm)
|
35
|
10
|
0.69
|
0.4
|
MOLDING
|
220℃*1H
|
|
JY-ZXHG0502
|
Special PET(μm)
|
50
|
12
|
5.34
|
—-
|
Aluminum Base Copper Clad Laminate,Hardware Spray Coating / Finishing,Wave Soldering,Electrical Insulation
|
25mm/220℃/0.5h
|
|
CY-ZXNT50C
|
PI(25μm)
|
50
|
25
|
8.61
|
—-
|
Aluminum Base Copper Clad Laminate,Hardware Spray Coating / Finishing,Wave Soldering,Electrical Insulation
|
25mm/220℃/0.5h
|
|
C0501515-598
|
PET(50μm)
|
80
|
各15
|
各>8(≤0.15)
|
—-
|
|
Double-sided UV Tape 150℃*30min
|
Details for Anti-static Products
|
Model
|
Backing Film
|
Thickness
|
Glue Thickness
|
180°Adhesion (after UV irradiation)
|
90°Adhesion (after UV irradiation)
|
Recommended Workpiece
|
Remarks
|
|
A15010-1E2D
|
PO(150μm)
|
160
|
10
|
16.1 (0.04)
|
2.40 (0.03)
|
8.5x10^9(Surface Resistance Value)
|
Anti-static Adhesive Surface
|
|
A15020-1E2D
|
PO(150μm)
|
170
|
20
|
23.6(0.05)
|
4.23 (0.03)
|
8.5x10^9(Surface Resistance Value)
|
Anti-static Adhesive Surface
|
|
B09010-2E2D
|
PO(90μm)
|
100
|
10
|
7.2 (0.1)
|
2.71 (0.03)
|
8.5x10^9(Surface Resistance Value)
|
Anti-static Adhesive Surface
|
|
V08010B-2E6
|
PVC(80μm)
|
90
|
10
|
3.5 (0.07)
|
1.59 (0.07)
|
8.5x10^9(Wafer)
|
Anti-static Adhesive Surface
|
TEST METHOD: GB2792-2014
●Adhesion: Measured at 20 min after applying and pressing tape to each adherent using a 2 kg roller rolled back and forth three times.
180° peel, pulling speed: 300 mm/min
●UV irradiation: High pressure mercury vapor lamp used. Irradiation was approximately 300 mJ/cm2.
(Intensity: approximately 75 mW/cm2 x approximately 4 seconds at 365 nm)
