Application and Process Flow of PI High-Temperature Tape in Semiconductor Manufacturing
The Gold Standard in Adhesive Tapes
PI (Polyimide) Tape utilizes a polyimide film as its substrate. Polyimide is a high-performance polymer renowned for its exceptional overall properties. It offers long-term resistance to high temperatures up to 240°C and exhibits superior thermal stability, maintaining stable physical and chemical properties even in extreme environments.
Furthermore, polyimide demonstrates excellent chemical stability with outstanding tolerance to various chemicals and solvents. Mechanically, it features high tensile strength, excellent tear resistance, and good abrasion resistance. Additionally, it provides superior electrical insulation, high dielectric strength, and outstanding aging resistance, ensuring long-term performance stability.
PI tape typically consists of a 25µm polyimide (PI) film substrate, an adhesive layer, and a compatible PET release liner. A variety of adhesives are available, primarily including silicone, acrylic, and hot-melt formulations. Different adhesive types impart distinct performance characteristics to the PI tape, catering to the diverse requirements of QFN packaging processes.
The polyimide film substrate offers excellent flexibility and mechanical strength. This allows the tape to conform tightly to complex surfaces while withstanding mechanical stress, ensuring it remains intact and resistant to damage during use.
QFN Moulding Tape #1025010-21C
1.Features
High Heat Resistance use by PI base film
TO prevent attachment of particles in a heat process
Minimum Contamination of Leadframe by adhesive Residue
2.Structure
|
Adhesive
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Base Maleriul
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Color
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Width
|
|
silica gel
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Polyimide
|
Amber
|
Max 500mm
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3.Applications
For fixing lead frme of IC package.
4.Properties
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Test Items
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Standard value
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Test value
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Test Mathod
|
|
Base Malerial Thickness (um)
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25±2
|
25
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ASTM D3652
|
|
Glue Thickness (um)
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10±2
|
10
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ASTM D3652
|
|
Substnte Thicknss (um)
|
50±3
|
50
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ASTM D3652
|
|
Aggregale Thickness (um )
|
35±4
|
35
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ASTM D3652
|
|
Adhesion( g/25mm)
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50-100
|
67
|
ASTM D3330
SUS304
|
|
Heal Resistancd （Our melal）
|
240°C*30min
|
|
Tempemture Endumncd Coppar foil)
|
220°C*1H
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5.Storage Condition
The storage period is hal fa year after shipment. Avoid direct sunlight and store at temperatures of
23+5°C and humidity under 55+10%.
QFN Packaging Process
