Semiconductor UV Dicing Tape
Our self-developed Semiconductor UV Tape is a critical protection material used in the packaging, dicing, grinding, and transportation processes of chips and components. The key feature of this tape is its significant change in adhesion upon UV exposure, allowing for both secure fixation and clean removal, thereby preventing damage to precision components.
Product Principle:
Utilizing a specially formulated UV-curable adhesive, the tape exhibits high tack before irradiation to firmly fix substrates like wafers and glass. After UV exposure, the adhesive layer cures and hardens, causing adhesion to drop sharply for easy, residue-free peeling.
Typical Applications:
Primarily used in precision processing stages such as Wafer Dicing, Glass Dicing, Ceramic Dicing, and Lens/Chip Dicing Protection.
Key Features:
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Controllable Adhesion: Significant adhesion change after UV curing. For example, peel strength can drop from 20 N/in to 0.02 N/in, ensuring easy removal without residue.
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Customizable Specifications: Supports customization of various thicknesses and widths.
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Environmental Stability: Excellent heat resistance, suitable for demanding semiconductor manufacturing environments.
